Storage
Memory is ubiquitous, from IoT servers to smartphones and PCs. Key stages—IC design, wafer fab, packaging, testing—determine success. With over 20 years in memory packaging, JCET ensures high yields and rapid product development. We partner closely with the world’s top memory makers, delivering stable mass production for NAND Flash and DRAM.
Product & Package Form增长分类
Storage
NAND Flash, DRAM, …
DDR FCCSP
LPDDR FBGA
UFS Hybrid BGA
USB LGA
Highlights
Pioneering vertical die-stack technology; High Si stacking structure
Extensive 3D NAND & DRAM product expertise
Industry-leading ultra-thin chip processing
Close collaboration with the top three global memory manufacturers
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